Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications) By Haleh Ardebili, Michael P

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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)
 By Haleh Ardebili, Michael P

Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications) By Haleh Ardebili, Michael P


Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)
 By Haleh Ardebili, Michael P


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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)
 By Haleh Ardebili, Michael P

  • Amazon Sales Rank: #3080223 in Books
  • Published on: 2009-06-25
  • Original language: English
  • Number of items: 1
  • Dimensions: 9.00" h x 1.10" w x 6.00" l, 2.05 pounds
  • Binding: Hardcover
  • 504 pages

About the Author Dr. Haleh Ardebili has a BS honors degree in Engineering Science and Mechanics from Pennsylvania State University at University Park, MS degree in Mechanical Engineering from Johns Hopkins University and PhD degree in Mechanical Engineering from University of Maryland at College Park. She has three years of industry experience as research scientist at General Electric Global Research Center at Niskayuna, New York. She is a recipient of GE Invention Fulcrum of Progress Award. She has several years of experience teaching engineering courses at University of Houston. In Sep 2010, she joined as Assistant Professor in the Mechanical Engineering Department at University of Houston. Her research work is mainly focused on nanomaterials for Energy Storage and Electronics.

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Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications) By Haleh Ardebili, Michael P


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